International Standard
ISO/TS 10303-1689:2018
Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
Reference number
ISO/TS 10303-1689:2018
Edición 5
2018-11
© ISO 2024
International Standard
Vista previa
No disponible en español
Publicado (Edición 5, 2018)
Esta norma se revisó y confirmó por última vez en 2022. Por lo tanto, esta versión es la actual.

Resumen

ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2018-11:

  • thermal isolation requirement definition;
  • electrical isolation requirement definition;
  • thermal isolation template for substrate design;
  • electrical isolation template for substrate design;
  • length tolerance on spacing requirement;
  • allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

Informaciones generales

  • Estado
     : Publicado
    Fecha de publicación
     : 2018-11
    Etapa
    : Norma Internacional confirmada [90.93]
  • Edición
     : 5
    Número de páginas
     : 11
  • Comité Técnico :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS actualizaciones

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Página de portada: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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