Status : Published (To be revised)
This standard was last reviewed and confirmed in 2014. Therefore this version remains current.
This standard will be replaced by ISO 9455-17
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Abstract

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.

This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.

General information

  • Status
     : Published
    Publication date
     : 2002-12
    Stage
    : International Standard to be revised [90.92]
  • Edition
     : 1
    Number of pages
     : 21
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
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