This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
Reference number
ISO/TS 10303-1677:2006
ISO/TS 10303-1677:2006
© ISO 2024
Technical Specification
ISO/TS 10303-1677:2006
Industrial automation systems and integration — Product data representation and exchange — Part 1677: Application module: Functional decomposition to interconnect design
Edition 1
2006-12
2006-12
Technical Specification
ISO/TS 10303-1677:2006
42539
Published
(Edition 1, 2006)
This publication was last reviewed and confirmed in 2023.
Therefore this version remains current.
Abstract
ISO/TS 10303-1677:2006 specifies the application module for Functional decomposition to interconnect design.
ISO/TS 10303-1677:2006 deals with the representation of the information needed to describe the assignment of a functional unit in a network definition to specific elements in the interconnect substrate design. ISO/TS 10303-1677:2006 defines the different means of performing swapping within a design. The types of swapping covered are the ones between gates in a single printed part, between identical gates in different instances of a printed part, and between terminals of identical type and behaviour in a gate.
The following are within the scope of ISO/TS 10303-1677:2006:
- allocation of a functional unit in a hierarchical network definition to a transmition line in the interconnect design;
- allocation of a functional unit in a hierarchical network definition to a fabrication joint line in the interconnect design.
General information
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Status: PublishedPublication date: 2006-12Stage: International Standard confirmed [90.93]
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Edition: 1Number of pages: 39
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Technical Committee :ISO/TC 184/SC 4ICS :25.040.40
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