ISO/TS 10303-1754:2006 - Industrial automation systems and integration — Product data representation and exchange — Part 1754: Application module: Via component

Withdrawn (Edition 1, 2006)

New version available: ISO/TS 10303-1754:2010

Abstract

ISO/TS 10303-1754:2006 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2006:

blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
cylinder vias, where the cross-section shape is constant;
tapered vias, where the cross-section shape may vary as the vertical distance changes;
stacked vias, where multiple bind and buried vias share the same x y position;
filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
interfacial connections, also known as through hole vias, which have both ends exposed;
items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

General information

Status
: Withdrawn

Publication date
: 2006-12

Stage
: Withdrawal of International Standard [95.99]
Edition
: 1

Number of pages
: 40
Technical Committee :
ISO/TC 184/SC 4

ICS :
25.040.40
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