Status : Withdrawn

This standard has been revised by ISO/TS 10303-1698:2014

Abstract

ISO/TS 10303-1698:2010-07 specifies the application module for Layered interconnect module design.

The following are within the scope of ISO/TS 10303-1698:2010-07:

  • design features;
  • material stackup;
  • design patterns;
  • metalization;
  • functional and physical network listing;
  • design layers;
  • artwork layers;
  • passages;
  • items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
  • items within the scope of application module Component grouping, ISO/TS 10303-1656;
  • items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
  • items within the scope of application module Footprint definition, ISO/TS 10303-1646;
  • items within the scope of application module Land, ISO/TS 10303-1692;
  • items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.

General information

  • Status
     : Withdrawn
    Publication date
     : 2010-07
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 3
    Number of pages
     : 8
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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