This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …
International Standard
ISO/TS 10303-1650:2018
Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die
Reference number
ISO/TS 10303-1650:2018
ISO/TS 10303-1650:2018
Edition 5
2018-11
2018-11
© ISO 2024
International Standard
p
ISO/TS 10303-1650:2018
76219
Published
(Edition 5, 2018)
This standard was last reviewed and confirmed in 2022.
Therefore this version remains current.
Abstract
ISO/TS 10303-1650:2018-11 specifies the application module for Bare die.
The following is within the scope of ISO/TS 10303-1650:2018-11:
The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.
- definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.
General information
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Status: PublishedPublication date: 2018-11Stage: International Standard confirmed [90.93]
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Edition: 5Number of pages: 11
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Technical Committee :ISO/TC 184/SC 4ICS :25.040.40
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Life cycle
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Previously
WithdrawnISO/TS 10303-1650:2014
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