Status : Published (Under review)

This standard was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1685:2018-11 specifies the application module for Interconnect module to assembly module relationship.

The following are within the scope of ISO/TS 10303-1685:2018-11:

  • assembly requirement for interconnect substrate;
  • assembly component based symbol placement in substrate requirement;
  • assembly component based annotation text placement in substrate requirement;
  • assembly component feature to layout feature requirement relationship;
  • external references for assembly component;
  • external references for assembly component feature;

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General information

  • Status
     : Published
    Publication date
     : 2018-11
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 4
    Number of pages
     : 11
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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Cover page: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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