Status : Published (Under review)

This standard was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation.

The following are within the scope of ISO/TS 10303-1689:2018-11:

  • thermal isolation requirement definition;
  • electrical isolation requirement definition;
  • thermal isolation template for substrate design;
  • electrical isolation template for substrate design;
  • length tolerance on spacing requirement;
  • allocation of an isolation requirement to a shield realized as part of an interconnect substrate.

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General information

  • Status
     : Published
    Publication date
     : 2018-11
    Stage
    : International Standard confirmed [90.93]
  • Edition
     : 5
    Number of pages
     : 11
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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Cover page: STEP Module and Resource Library (SMRL) v10
STEP Module and Resource Library (SMRL) v10
This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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