Abstract
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
General information
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Status: PublishedPublication date: 2020-09Stage: International Standard published [60.60]
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Edition: 4Number of pages: 13
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Technical Committee :ISO/TC 44/SC 12ICS :25.160.50
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Life cycle
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Previously
WithdrawnISO 9453:2014
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Now