Status : Withdrawn

This standard has been revised by ISO/TS 10303-1650:2018

Abstract

ISO/TS 10303-1650:2014-08 specifies the application module for Bare die.

The following is within the scope of ISO/TS 10303-1650:2014-08:

The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package.

  • definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.

General information

  • Status
     : Withdrawn
    Publication date
     : 2014-08
    Stage
    : Withdrawal of International Standard [95.99]
  • Edition
     : 4
    Number of pages
     : 11
  • Technical Committee :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
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Life cycle

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